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Applications Engineering Manager

R&D • Tempe, 85280, United States • Full-time
AI Job Summary
  • 7+ years in Applications Engineering, Technical Sales, or Engineering Management with customer-facing project experience
  • Deep expertise in 2.5D/3D integration, FOWLP/FOPLP, hybrid bonding, and bridge architectures
  • Experience overseeing full lifecycle of customer projects, ensuring timelines, milestones, and deliverables are met

Role Type

On-site • Permanent • Full-time • Mid-level Senior

Pay Rate

120,000 USD – 160,000 USD (Annum)

Description

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SyentaÌýis pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products buildÌýcutting edgeÌýadvanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.Ìý

Founded in Australia, our growing footprint in the USÌýrepresentsÌýa key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.Ìý

AboutÌýthe RoleÌý

We are seeking anÌýApplication Engineering ManagerÌýto serve as the primary technical interface betweenÌýSyenta’sÌýadvanced manufacturing technology and our global customer base.ÌýÌý

This is a high-impact, hybrid role requiring a blend ofÌýdeep semiconductor technicalÌýexpertise, project management discipline, and commercial acumen. You will translate complex customer requirements into actionable project proposals, oversee technical delivery, and build the foundational applications engineering team responsible for customer success.ÌýÌý

This role is critical to scalingÌýSyenta’sÌýcustomer engagements and strengthening our technical credibility in advanced packaging.Ìý

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Technical Sales InterfaceÌýÌý

  • Act as the lead technical expert during the pre-sales processÌýÌý
  • Conduct deep-dive discovery sessions to understand customer requirements, constraints, and pain pointsÌýÌý
  • Translate customer needs into technicallyÌýviableÌýand commercially aligned solutionsÌýÌý

Proposal DevelopmentÌýÌý

  • Design and develop detailed project proposals including scope, milestones, and technical approachÌýÌý
  • Ensure alignment between customer requirements andÌýSyenta’sÌýproduct capabilitiesÌýÌý
  • Own feasibility assessments across advanced packaging applicationsÌýÌý

Project Management & DeliveryÌýÌý

  • Oversee the full lifecycle of customer projects fromÌýkickoffÌýthrough deliveryÌýÌý
  • Ensure timelines, technical milestones, and deliverables are metÌýÌý
  • Maintain high ownership and accountability across all active projectsÌýÌý

Technical EscalationsÌýÌý

  • Serve as the final escalation point for complex technical challengesÌýÌý
  • Work cross-functionally with R&D, process, and hardware teams to resolve issuesÌýÌý
  • Maintain strong customer trust through effective problem resolutionÌýÌý

Customer Engagement & PresentationÌýÌý

  • Deliver technical presentations, demos, and updates to customer stakeholdersÌýÌý
  • Interface with senior technical leaders (e.g., CTOs, Directors of Engineering)ÌýÌý
  • Handle sensitive technical information with professionalism and discretionÌýÌý

Team Leadership & Build-OutÌýÌý

  • Recruit, mentor, and manage a growing team of applications engineersÌýÌý
  • Establish best practices for customer interaction, documentation, and project trackingÌýÌý
  • Build scalable processes to support increasing customer demandÌý

Ìý

RequirementsÌý

ExperienceÌýÌý

  • 7+ years in Applications Engineering, Technical Sales, or Engineering ManagementÌýÌý
  • Background in high-tech industries such as semiconductors, advanced packaging, or electronicsÌýÌý
  • Proven experience managing customer-facing technical projectsÌýÌý

EducationÌýÌý

  • B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related fieldÌýÌý

Technical ExpertiseÌýÌý

  • Strong understanding ofÌýadvanced semiconductor packaging, including:ÌýÌý
  • 2.5D, 3D integration, FOWLP / FOPLP, Hybrid bonding, Bridge architecturesÌýÌý
  • Familiarity withÌýchip-last, chip-on-wafer/substrate processesÌýÌý
  • Experience with hardware/software integration, CAD/CAM tools, and system-level troubleshootingÌýÌý

Communication & Customer SkillsÌýÌý

  • Ability to clearly communicate complex technical concepts to both technical and non-technical audiencesÌýÌý
  • Strong customer-facing experience, including presenting and managing sensitive informationÌýÌý
  • Proven ability to translate customer requirements into actionable technical plansÌýÌý

LeadershipÌýÌý

  • Demonstrated experience leading technical teams and driving project executionÌýÌý
  • High ownership mindset with the ability toÌýoperateÌýautonomously in a fast-paced environmentÌý

Why ChooseÌýSyenta?Ìý

This is a rare opportunity toÌýbuild a critical function from the ground upÌýat a pivotal stage of company growth.Ìý

What We OfferÌý

Salary Range: US $140k – $180k (negotiable)Ìý

  • Early-stage equity opportunitiesÌý
  • Potential 401(k) and other benefitsÌý
  • Comprehensive health, dental, and vision coverage plans, supported by CompanyÌý
  • Professional Growth –ÌýWe’reÌýscaling fast, so responsibilities can expand significantly in tandem with the businessÌý
  • Team Events – Annual company event in Australia to collaborate and celebrateÌý
  • Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal lifeÌý
  • 15 days PTO and 10 days sick leaveÌý

Ìý

SyentaÌýis an Equal Opportunity Employer. We do not discriminateÌýon the basis ofÌýrace,Ìýcolor, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.Ìý